DECO Showcases Contactless mmWave Interconnects for Industrial Equipment at CIIF 2026
SHANGHAI, China, October 12, 2026 — DECO Integration Technology Co., Ltd. (“DECO”), a developer of ultra-short-range millimeter-wave (mmWave) connectivity chips, is showcasing its wireless connectivity modules at the 26th China International Industry Fair (CIIF), taking place October 12–16 at the National Exhibition and Convention Center in Shanghai. The exhibit features contactless data interconnect solutions for stationary and rotating applications, offering additional options for interconnect design and mechanical integration in industrial automation and robotics.